Box PC

– 4th Generation Intel® CoreTM and Xeon® Processor (Haswell)
– Up to 16GB (2 x SODIMM DDR3 1333/1600 MHZ)
– 4 x USB 2.0, 2 x USB 3.0, 4 x DB9 (RS232/422/485), 2 x LAN, 8-bit DIO
– 5 expansion slots (2 x PCI, 2 x PCIe x16, PCIe x4)
– 9-36V DC-in

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– AMD Ryzen™ Embedded R1000 Series
– Ultra Small Size: 112.29 x 80 x 56.20mm (W x H x D)
– Expansion Options of 2 serial ports or LTE or WiFi
– I/O: 1 Intel GbE, I USB 3.1 Gen 2, 2 Micro HDMI
– 10-Year CPU Life Cycle Support

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– 8th/9th Gen Intel® Core™ Processors with Intel® C246/Q370/H310 Chipset
– Two DDR4 SODIMM up to 64GB
– 1 x M.2 SSD + 2 x 2.5″ SSD
– 2 Intel GbE, 4 USB 3.1, 2 USB 2.0, 2 COM
– 2 HDMI 2.0 Support resolution 4K@60Hz

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– 11th Gen Intel® Core™ i7/i5/i3 Processors
– 8GB and 1 SO-DIMM DDR4 onboard
– 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz)
– Up to 4 LAN or 6 USB
– 5G Support

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– 10th/11th gen Intel® Core™ i9/i7/i5/i3 or Celeron® processor (Comet Lake-S) up to 65W
– 4 GbE LAN and 4 COM ports
– Dual 2.5″ SATA HDD drive bays
– 2 HDMI and 1 DisplayPort with dual view supported
– Operating temperature from -40°C to +70°C

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– Hailo-8™ AI processor, up to 26 TOPS
– Dual GbE for GigE cameras and LiDAR connectivity
– Supports Wi-Fi/Bluetooth/5G/LTE wireless connection
– Supports Linux operating system
– Operating temperature from -20°C to +70°C

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– Intel Atom® x6212RE or x6414RE processor
– 6 isolated COM, isolated DIO (8-in/8-out), 3 2.5 GbE LAN
– 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
– Supports TPM 2.0
– Operating temperature from -40°C to +70°C

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– 12th gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake-P)
– 4 isolated COM, isolated DIO (8-in/8-out), 4 2.5 GbE LAN
– 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
– 4 isolated COM, isolated DIO (8-in/8-out), 4 2.5 GbE LAN
– Operating temperature from -40°C to +70°C

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– RISC-based (i.MX 6UltraLite) processor 528 MHz
– 256MB DDR3 SDRAM onboard
– 4GB eMMC flash onboard
– 2 PCI Express Mini Card slots
– Extended temperature

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– 7th Generation Intel® Core™ Processors (Kaby Lake)
– Up to 32GB (2 x SODIMM DDR4 1866/2133 MHZ)
– 2 x USB 2.0, 4 x USB 3.0, 2 x LAN
– SATA 3.0, M.2 2280 (M Key)
– Standard temperature (0 to +40C)

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– Intel® Pentium® or Celeron® Processor (Apollo Lake)
– Up to 8GB (1 x SODIMM DDR3L 1600 MHZ)
– 1 x RS-232, 4 x USB 2.0, 2 x USB 3.0, 2 x LAN, 1 x Remote ON/OFF
– SATA 3.0
– Standard temperature (-5 to +60C)

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– Intel® Core™ i5-7300U or Celeron® 3965U
– M.2 Key B 2242 for storage
– Azure certified and AMS.AXView 3.0 supported
– DisplayPort++, 2 COM, 4 USB and 2 GbE LAN
– Multiple mounting designs: Wall mount, DIN-rail and
VESA mount

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– Intel® Pentium® Processor (Braswell)
– Up to 8GB (1 x SODIMM DDR3L 1600 MHZ)
– 1 x RS-232/422/485, 1 x RS-232, 4 x USB 3.0, 2 x LAN
– SATA, mSATA
– Extended temperature (-20 to +55C)

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– 7th Generation Intel® Core™ Processors (Kaby Lake)
– Up to 16GB (1 x SODIMM DDR4 2133 MHZ)
– 2 x RS-232/422/485, 4 x USB 3.0, 2 x LAN
– SATA, mSATA
– Standard temperature (-10 to +50C)

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– Intel® Celeron® Processor (Apollo Lake)
– Up to 8GB (1 x SODIMM DDR3L 1867 MHZ)
– 2 x RS-232/422/485, 1 x RS-232, 2 x USB 2.0, 4 x USB 3.0, 2 x LAN
– SATA, mSATA
– Extended temperature (-20 to +60C)

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– Intel® Pentium® or Celeron® Processor (Apollo Lake)
– Up to 8GB (1 x SODIMM DDR3L 1867 MHZ)
– 2 x RS-232/422/485, 2 x RS-232, 2 x USB 2.0, 4 x USB 3.0, 2 x LAN
– SATA, mSATA
– Extended temperature (-20 to +60C)

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– Socket LGA1151, for 6/7th generation Intel® Core™ processor (Skylake or Kaby Lake), TDP up to 65W
– Up to 32GB (2 x SODIMM DDR4)
– 2 x RS-232/422/485, 2 x USB 2.0, 4 x USB 3.0, 1 x DIO (6-in & 2-out Isolated), 2 x LAN, 8 x PoE (up to 90W)
– 2 x SATA, mSATA
– Up to Industrial temperature

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– 8th gen Intel® Core™ i7/i5/i3 & Celeron® with Intel® Q370 chipset (Coffee Lake-S)
– 4-CH PoE (IEEE802.3at compliance)
– Dual swappable 2.5″ SATA HDD drive bay with RAID 0 &1
– Supports MXM 3.1 type A graphics module (optional)

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– – Socket LGA1151, for 6/7th generation Intel® Core™ processor (Skylake or Kaby Lake), TDP up to 35W
– Up to 32GB RAM (2 x DDR4 SODIMM)
– Wide range power input (9 to 36VDC)
– Extended temperature (-40C t  +50C)

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– 7th generation Intel® Core™ i5 or Celeron® processor (Kaby Lake)
– Up to 16GB RAM (1 x DDR4-2133 SODIMM)
– IP67 casing with M12 lockable I/Os
– Extended temperature (-30C t  +60C)

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– Intel® Atom® E processors (Bay Trail)
– Up to 8GB RAM (1 x DDR3L-1066/1333 SODIMM)
– IP67 casing with M12 lockable I/Os
– Extended temperature (-30C t  +60C)

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– 6/7th generation Intel® Core™ processor (Skylake or Kaby Lake)
– 4 or 8 GB RAM (onboard DDR4 2133MHz)
– Wide range mounting options (Wall, VESA or DIN-Rail)
– Extended temperature (-20C to +60C)

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– 6/7th generation Intel® Core™ processor (Skylake or Kaby Lake)
– 4 or 8 GB RAM (onboard DDR4 2133MHz)
– Extensive I/O support (2 x PoE, 2 x RS-232/422/485, 4 x RS-232)
– Extended temperature (-20C to +60C)

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– Intel® Atom® X processors (Apollo Lake)
– 2 or 4 GB RAM (onboard LPDDR4 2400MHz)
– Mounting options (Wall and DIN-Rail)
– Extended operating temperature: -20 to 60°C

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– 7th Generation Intel® Xeon® or Core™ Processors (Kaby Lake)
– Up to 32GB RAM (2 x DDR4-2400 SODIMM, ECC support with CM238)
– Tripple display support
– Up to Industrial temperature support (-40C to +70C)

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– Socket LGA1151, for 6/7th generation Intel® Core™ processor (Skylake or Kaby Lake), TDP up to 35W
– Up to 32GB RAM (2 x DDR4-1866/2133 SODIMM)
– Tripple display support
– Standard temperature

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– Intel® Atom® X and Pentium® processors (Apollo Lake)
– 2, 4 or 8GB RAM (onboard LPDDR4 2400MHz)
– Wide range mounting options (Wall, VESA or DIN-Rail)
– Up to Industrial temperature support (-40C to +70C)

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– NXP i.MX6 ARM® Cortex™-A9 series CPU
– 1 or 2GB RAM (Soldered DDR3L 1600MHz)
– Wide range DC input (9-36V)
– Extended or Industrial temperature

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– Intel® Celeron® processors (Bay Trail)
– Up to 8GB RAM (1 x DDR3L-1066/1333 SODIMM)
– Supports 2 x PCI or 2 x PCIe (x1)
– Extended temperature (-10C to +55C)

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– Socket LGA1151, for 6/7th generation Intel® Core™ processor (Skylake or Kaby Lake), TDP up to 35W
– Up to 32GB RAM (2 x DDR4 SODIMM)
– Supports 1 x PCI or 1 x PCIe (x16)
– Standard temperature (0C to +50C)

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– Socket LGA1151, for 6/7th generation Intel® Core™ processor (Skylake or Kaby Lake), TDP up to 65W
– Up to 32GB RAM (2 x DDR4 SODIMM)
– Supports either 2 x PCI, 1 x PCI & 1 x PCIe (x16) or 1 x PCIe (x16) & 1 CPIe (x4)
– Extended temperature (-10C to +60C)

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– LGA1151 Socket 7th/6th gen Intel® Core™ i7/i5/i3 & Celeron® processor, up to 65W (codename: Kaby Lake/Skylake)
– Intel® Q170 chipset
– -10°C to +60°C operating temperature range
– Supports 2 swappable 2.5″ HDD & RAID 0,1

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– Intel® Pentium® or Celeron® Processor (Apollo Lake)
– Up to 8GB (1 x DDR3L 1866MHz SODIMM)
– up to 4 x isolated RS-232/-422/-485 interfaces
– Extended temperature (-20C to +70C)

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– Intel® Celeron® Processor (Apollo Lake)
– Up to 8GB (1 x DDR3L 1866MHz SODIMM)
– Different configurations (4 x PoE max 30W, 1 x CAN 2.0 A/B, 4 x Gbe LAN)
– up to industrial temperature (-40C to +70C)

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– 7th Generation Intel® Core™ Processors (Kaby Lake)
– Up to 16GB (1 x DDR4 2133MHz SODIMM)
– Dual Modular I/O Expansion slots
– Industrial temperature (-40C to +70C)

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– NXP i.MX6 ARM® Cortex™-A7 series CPU
– 512MB RAM (Soldered DDR3 1600MHz)
– Wide range DC input (9-36V)
– Extended or Industrial temperature

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