EC553-DL - Robust, Compact Embedded System

4th Generation Intel® Xeon® / Intel® CoreTM / Celeron®
Modular-Designed Embedded System

EC553-DL
EC553-DL front

4th Generation Intel® Xeon® / Intel® CoreTM / Celeron®
Modular-Designed Embedded System

• Chipset: Intel C226 Express
• RAM: 16GB (2 x 204-Pin DDR3 1333/1600MHz SO-DIMM)
• Storage: 2x SATA
• USB: 4x 2.0, 2x 3.0
• COM: 4x RS-232/422/485
• LAN: 2x GbE
• IO: 8x DIO
• Display: 1x VGA, 1x DP
• Audio: 1x Line in, 1x Line out, 1x Mic in
• Expansion: 1x Mini PCIe
• Power supply: 9 – 36 VDC
• Operating temp: 0 to 50°C
• Storage temp: -20 to 85°C
• Certification/approval: CE, FCC Class A, RoHS

Specifications

  • Intel® Xeon® Modular-Designed System
  • Supports DDR3 SODIMM up to 16GB
  • 2x 2.5" SATA drive bays
  • 5 expansion slots: 2 PCIe x16, 1 PCIe x4, 2 PCI
  • 1 Vertical USB for securing data from unauthorized access

Documentation

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