COM Express Modules

– AMD® Ryzen™ R1000 Series Processor
– Single Channel LPDDR4 2400MHz；Memory Down up to 8GB
– Multiple expansions: 3 PCIe x1
– Rich I/O: 1 Intel GbE, 2 USB 3.1, 8 USB 2.0

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– 11th Generation Intel® Processor COM Express® Mini
– Single Channel LPDDR4X 4266MHz；Memory Down up to 16GB
– Multiple expansions: 1 PCIe x4, 2 I2C, 1 SMBus
– Rich I/O: 1 Intel GbE, 2 USB 3.2, 8 USB 2.0

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– Intel® Atom® E3900 Processor Series
– Dual Channel LPDDR4-2400MHz Memory Down up to 8GB
– Multiple expansions: 4 PCIe x1
– Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0

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– Intel® Atom® processors (Elkhart Lake)
– Dual Channel LPDDR4X 3200MHz/4267MHz up to 16GB
– Multiple expansions: 4 PCIe x1
– Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0

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– Intel® Pentium® processor N4200 & Celeron® processor N3350 (Apollo Lake)
– Onboard 4GB DDR3L memory
– Max. up to 4 lanes of PCI Express
– 2 USB 3.0 and 8 USB 2.0

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– Intel® Atom® processors (Apollo Lake)
– 4GB RAM (Soldered DDR3L), Option 8GB RAM
– COM Express® Mini, Type 10
– Extended or Industrial Temperature

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– Intel® Atom® processors (Apollo Lake)
– 4GB RAM (Soldered DDR3L), Option 8GB RAM
– COM Express® Mini, Type 10
– Extended or Industrial Temperature

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– Intel® Atom® processors (Apollo Lake)
– 4GB RAM (Soldered DDR3L), Option 8GB RAM
– COM Express® Mini, Type 10
– Extended or Industrial Temperature

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– 8th Generation Intel® Core™ Processors (Whiskey Lake)
– Up to 16GB RAM (Soldered DDR3L)
– COM Express® Mini, Type 10
– Standard Temperature (optional industrial)

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– Intel® Pentium®/Celeron® N3000
– Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0
– Multiple expansions: 3 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
– Dual channel DDR3L 1600MHz SODIMM up to 8GB

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– 8th Generation Intel® Core™ Processor
– DDR4 2400/2133MHz SODIMM up to 64GB
– Multiple expansions: 4 or 5 PCIe x1 + 1 PCIe x4 or 3 PCIe x1 + 2 PCIe x2, 1 LPC, 1 I²C, 1 SMBus, 2 UART
– DP++ supports 4K x 2K resolution

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– 11th Generation Intel® Processor COM Express® Compact
– DDR4 3200MHz SODIMM up to 64GB
– Multiple expansions: 8 PCIe x1, 1 I2C, 1 SMBus
– DP++ supports 4K x 2K resolution

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– Intel® Atom®, Celeron® & Pentium® processors (Apollo Lake)
– Up to 8GB RAM (2 x SODIMM DDR3L 1600 MHz)
– COM Express® Compact, Type 6
– Standard and Industrial temperature options

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–  12th gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake U)
– Dual channel DDR4-3200 SO-DIMM for up to 64GB
– Up to 8 lanes of PCI Express
– 4 USB 3.0 and 8 USB 2.0

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–  AMD Ryzen™ Embedded V1000 processors
– 2 DDR-2400/3200 SO-DIMM for up to 64GB of memory
– Max. up to 7 lanes of PCI Express
– 3 USB 3.0 and 8 USB 2.0

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–  Intel® Atom® x5 and x7 processors (Apollo Lake)
– 2 DDR3L-1600 SO-DIMM for up to 8GB of memory
– COM Express® Compact, Type 6
– 4 USB 3.0 and 8 USB 2.0

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– 8th gen Intel® Core™ i7/i5/i3 and Celeron® processors
(Whiskey Lake-U)
– 2 DDR4-2400 SO-DIMM for up to 64GB
– COM Express® Compact, Type 6
– Standard Temperature

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– Intel® Atom® processors (Bay Trail)
– Up to 8GB RAM (2 x SODIMM DDR3 1066/1333/1600 MHz)
– COM Express® Compact, Type 6
– Standard temperature, options Extended and Industrial temperature

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– 7th Generation Intel® Core™ Processors (Kaby Lake)
– 4, 8 or 16GB RAM (Soldered DDR4 2133MHz)
– COM Express® Compact, Type 6
– Standard and Industrial temperature options

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– 8th/9th Generation Intel® Core™ Processor
– Dual channel DDR4 2666MHz SODIMM up to 96GB
– Multiple expansion: 1 PCIe x16, 8 PCIe x1
– Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0

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– 11th Generation Intel® Processor
– DDR4 3200MHz SODIMM up to 128GB
– Multiple expansion: 1 PCIe x16, 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
– Rich I/O: 1 Intel 2.5GbE, 4 USB 3.2 Gen2, 8 USB 2.0

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– Intel® Xeon® & 9th/8th gen Intel® Core™ processors
– Dual channel DDR4-2666 SO-DIMM for up to 96GB of memory
– 1 PCIe x16 and 8 PCIe x1 Gen3
– 4 SATA Gen3 with RAID 0/1/5/10

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– Intel® Xeon® and 7th Generation Intel® Core™ Processors (Kaby Lake)
– Up to 32GB RAM (2 x SODIMM DDR4 2133 MHz)
– COM Express® Basic, Type 6
– Industrial temperature

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– Intel® Xeon® & 8th gen Intel® Core™ i7/i5/i3 processors
(Coffee Lake)
– 2 DDR4-2666 SO-DIMM slots for up to 32GB
– COM Express® Basic, Type 6
– 1 PCIe x16 and 8 PCIe x1 Gen3

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– Intel® 8th Generation Intel® Core™ Processors (Coffee Lake)
– Up to 32GB RAM (2 x SODIMM DDR4 2666 MHz)
– COM Express® Basic, Type 6
– Standard temperature or Industrial temperature with heat spreader

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– Intel® Xeon® and 8th Generation Intel® Core™ Processors (Coffee Lake)
– Up to 32GB RAM (2 x SODIMM DDR4 2666 MHz, ECC support)
– COM Express® Basic, Type 6
– Standard or Industrial temperature

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– AMD® Ryzen™ V1000/R1000 Series Processor
– Up to 32GB RAM (2 x SODIMM DDR4 2400/3200 MHz)
– AMD® Radeon™ Vega GPU with up to 11 Compute Units
– COM Express® Basic, Type 6
– Standard temperature or Industrial temperature with cooler

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– 7th Generation Intel® Core™ Processors (Kaby Lake)
– Up to 32GB RAM (2 x SODIMM DDR4 2400 MHz)
– COM Express® Basic, Type 6
– Standard or Industrial temperature

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– 7th Generation Intel® Xeon® or Core™ Processors (Kaby Lake)
– Up to 32GB RAM (2 x SODIMM DDR4 2400 MHz, ECC support with CM238)
– COM Express® Basic, Type 6
– Standard or Industrial temperature

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– Intel® Xeon® and 6th Generation Intel® Core™ Processors (Skylake)
– 8 or 16GB RAM (Soldered DDR4 2133MHz)
– COM Express® Basic, Type 6
– Standard or Industrial temperature

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– Intel® Xeon® D and Intel® Pentium® D Processors (Broadwell-DE)
– Up to 32GB RAM (2 x SODIMM DDR4 2400 MHz, ECC support)
– 2 x 10GBASE-KR with Intel® 10G Ethernet controller
– COM Express® Basic, Type 7
– Standard temperature or Industrial temperature

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– Intel® Atom® C-Series processors (Denverton)
– Up to 32GB RAM (2 x SODIMM DDR4 2400 MHz, ECC support)
– Supports up to Two 10GBASE-KR Interfaces and Max up to Four 10GbE MAC Ports
– COM Express® Basic, Type 7
– Standard temperature or Extended temperature with heat spreader

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