COM Express Modules

COM Express Modules - Product listing

COM Express - Mini

Footprint of 55 x 84 mm.

AL9A2

– Intel® Atom® processors (Apollo Lake)
– 4GB RAM (Soldered DDR3L), Option 8GB RAM
– COM Express® Mini, Type 10
– Extended or Industrial Temperature

AL9A3

– Intel® Atom® processors (Apollo Lake)
– 4GB RAM (Soldered DDR3L), Option 8GB RAM
– COM Express® Mini, Type 10
– Extended or Industrial Temperature

CEM310

– Intel® Atom® processors (Apollo Lake)
– 4GB RAM (Soldered DDR3L), Option 8GB RAM
– COM Express® Mini, Type 10
– Extended or Industrial Temperature

WL9A3

– 8th Generation Intel® Core™ Processors (Whiskey Lake)
– Up to 16GB RAM (Soldered DDR3L)
– COM Express® Mini, Type 10
– Standard Temperature (optional industrial)

COM Express - Compact

Footprint of 95 x 95 mm

AL968

– Intel® Atom®, Celeron® & Pentium® processors (Apollo Lake)
– Up to 8GB RAM (2 x SODIMM DDR3L 1600 MHz)
– COM Express® Compact, Type 6
– Standard and Industrial temperature options

CEM312

– Intel® Atom® x5 and x7 processors (Apollo Lake)
– 2 DDR3L-1600 SO-DIMM for up to 8GB of memory
– COM Express® Compact, Type 6
– 4 USB 3.0 and 8 USB 2.0

CEM521

– 8th gen Intel® Core™ i7/i5/i3 and Celeron® processors
(Whiskey Lake-U)
– 2 DDR4-2400 SO-DIMM for up to 64GB
– COM Express® Compact, Type 6
– Standard Temperature

H6825, com express modules, computer on module

Hectronic H6825

– Intel® Atom® processors (Bay Trail)
– Up to 8GB RAM (2 x SODIMM DDR3 1066/1333/1600 MHz)
– COM Express® Compact, Type 6
– Standard temperature, options Extended and Industrial temperature

KU968

– 7th Generation Intel® Core™ Processors (Kaby Lake)
– 4, 8 or 16GB RAM (Soldered DDR4 2133MHz)
– COM Express® Compact, Type 6
– Standard and Industrial temperature options

COM Express - Basic

Footprint of 95 x 125 mm

CEM510

– Intel® Xeon® and 7th Generation Intel® Core™ Processors (Kaby Lake)
– Up to 32GB RAM (2 x SODIMM DDR4 2133 MHz)
– COM Express® Basic, Type 6
– Industrial temperature

CEM520

– Intel® Xeon® & 8th gen Intel® Core™ i7/i5/i3 processors
(Coffee Lake)
– 2 DDR4-2666 SO-DIMM slots for up to 32GB
– COM Express® Basic, Type 6
– 1 PCIe x16 and 8 PCIe x1 Gen3

CH960-HM370

– Intel® 8th Generation Intel® Core™ Processors (Coffee Lake)
– Up to 32GB RAM (2 x SODIMM DDR4 2666 MHz)
– COM Express® Basic, Type 6
– Standard temperature or Industrial temperature with heat spreader

CH960-CM246/QM370

– Intel® Xeon® and 8th Generation Intel® Core™ Processors (Coffee Lake)
– Up to 32GB RAM (2 x SODIMM DDR4 2666 MHz, ECC support)
– COM Express® Basic, Type 6
– Standard or Industrial temperature

GH960

– AMD® Ryzen™ V1000/R1000 Series Processor
– Up to 32GB RAM (2 x SODIMM DDR4 2400/3200 MHz)
– AMD® Radeon™ Vega GPU with up to 11 Compute Units
– COM Express® Basic, Type 6
– Standard temperature or Industrial temperature with cooler

KH960-HM175

– 7th Generation Intel® Core™ Processors (Kaby Lake)
– Up to 32GB RAM (2 x SODIMM DDR4 2400 MHz)
– COM Express® Basic, Type 6
– Standard or Industrial temperature

KH960-CM238/QM175

– 7th Generation Intel® Xeon® or Core™ Processors (Kaby Lake)
– Up to 32GB RAM (2 x SODIMM DDR4 2400 MHz, ECC support with CM238)
– COM Express® Basic, Type 6
– Standard or Industrial temperature

SH960MD-CM236/QM170

– Intel® Xeon® and 6th Generation Intel® Core™ Processors (Skylake)
– 8 or 16GB RAM (Soldered DDR4 2133MHz)
– COM Express® Basic, Type 6
– Standard or Industrial temperature

CEM700

– Intel® Xeon® D and Intel® Pentium® D Processors (Broadwell-DE)
– Up to 32GB RAM (2 x SODIMM DDR4 2400 MHz, ECC support)
– 2 x 10GBASE-KR with Intel® 10G Ethernet controller
– COM Express® Basic, Type 7
– Standard temperature or Industrial temperature

DV970

– Intel® Atom® C-Series processors (Denverton)
– Up to 32GB RAM (2 x SODIMM DDR4 2400 MHz, ECC support)
– Supports up to Two 10GBASE-KR Interfaces and Max up to Four 10GbE MAC Ports
– COM Express® Basic, Type 7
– Standard temperature or Extended temperature with heat spreader

COM Express - Extended

Footprint of 110 x 155 mm

COM Express Modules