Mini-ITX – Pico-ITX

ITX

This is a low-power CPU board form factor often used in passively cooled embedded systems. Mini-ITX has similarities with for example ATX and microATX form factors but is significantly smaller (170mm x 170mm). The form factor was announced by VIA Technologies in 2001.

Pico-ITX is a low-power single board computer form factor often used in passively cooled embedded systems. The dimensions of an embedded Pico-ITX motherboard are 100mm x 72mm which is half the area of Nano-ITX. Today embedded Pico-ITX single board computers can use the choice of either ARM or x86-based platforms. The compact size, low power consumption and high performance makes embedded Pico-ITX SBCs ideal for many space-constrained embedded design applications and markets. This includes industrial automation, medical, maritime, communication and transportation.

Questions about Pico-ITX and Mini-ITX? Get in touch!

ITX - Product listing

Pico-ITX

H6080 1 png

H6080

– Dual or Quad Core NXP i.MX8M SoC
– Soldered eMMC Flash and LPDDR4 RAM
– M.2 Expansion slot with SIM interface
– Industrial temperature range (-40°C to +85°C)

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AL253 front

AL253

– Single channel DDR3L SODIMM + 2G/4G/8G DDR3L memory on board
– Multiple OS support: Win 7/Win 10/Linux
– Rich I/O: max. 4 Intel GbE, 5 COM, 4 USB 3.0, 2 USB 2.0
– DP resolution up to 4096×2160 @ 60Hz

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Capa311 front

CAPA311

– Intel® Atom® x5-E3940 processor
– 1 DDR3L SO-DIMM for up to 8GB of memory
– 2 USB 2.0 and 4 USB 3.0
– 2 full-size PCI Express Mini Card slots

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Capa13r front

CAPA13R

– AMD Ryzen™ Embedded V1807B and V1605B APU
– 1 DDR4 SO-DIMM for up to 16GB of memory
– 4 GbE LAN
– Supports quad-view

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Capa520 front

CAPA520

– LGA1151 socket 9th/8th gen Intel® CoreTM i7/i5/i3 processor
– 1 DDR4 SO-DIMM for up to 16GB of memory
– 3 GbE LAN
– 1 PCI Express Mini Card slot

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GH551 front

GH551

– AMD® Ryzen™ V1000/R1000 Series 3.5″ SBC
– 1 DDR4 2400MHz SODIMM up to 16GB
– Multiple Expansion: 1 M.2 M Key, 1 Mini PCIe
– Rich I/O: 3 GbE, 2 USB 3.1 Gen2, 1 USB 2.0

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WL551 front

WL551

– 8th Gen Intel® CoreTM 3.5″ SBC
– 1 DDR4 2400MHz SODIMM up to 32GB
– Supports 4K/2K resolution
– 3 Intel GbE, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0

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Pico317

PICO317

– Dual-core Intel® Atom® x5-E3940 processor (Apollo Lake)
– 1 DDR3L-1867 SO-DIMM for up to 8GB of memory
– 2 COM, 2 USB 2.0, and 3 USB 3.0
– Wide operating temperature range from -40°C to +70°C

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Pico52r front

PICO52R

– 8th gen Intel® Core™ i7/i5/i3 and Celeron® processor
– 1 DDR4 SO-DIMM for up to 16GB of memory
– 2 USB 2.0 and 2 USB 3.0
– 2 GbE LAN

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WL051 front

WL051

– 8th Gen Intel® CoreTM Processor
– 1 DDR4 SODIMM up to 16GB
– DP++/HDMI + eDP
– 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 2, 2 USB 2.0

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m8m051 front

M8M051

– NXP® i.MX 8M Series
– 1 LPDDR4 3200MHz SODIMM
– Supports 4K/2K resolution
– 1 Intel GbE, 3 COM, 1 USB 3.1 Gen1, 4 USB 2.0

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AL05P

AL05P

– Intel® Atom® processors (Apollo Lake)
– Up to 4GB SDRAM (Soldered DDR4 2400MHz)
– PoE Powered Devices 48VDC
– Standard or Extended temperature

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pico itx, sbc, single board computer

AL051

– Intel® Atom® X processors (Apollo Lake)
– Up to 8GB RAM (1 x SODIMM for DDR3L 1866 MHz)
– Tripple Display (VGA, Mini DP & LVDS)
– Standard, Extended or Industrial temperature

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pico itx, sbc, single board computer

AL053

– Intel® Atom® X processors (Apollo Lake)
– Up to 8GB RAM (1 x SODIMM for DDR3L 1866 MHz)
– Wide DC input (9 – 36V)
– Standard, Extended or Industrial temperature

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PICO-KBU4, pico itx, sbc, single board computer

PICO-KBU4

– 7th Generation Intel® Core™ Processors (Kaby Lake)
– Up to 16GB RAM (1 x SODIMM for DDR4 1866/2133 MHz)
– Expansion slot: M.2. 2230 (E Key),  Option BIO module
– Standard temperature

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PICO50R, sbc, single board computer, pico-itx, itx

PICO50R

– 6th Generation Intel® Core™ or Celeron® Processors (Skylake)
– Up to 16GB RAM (1 x SODIMM for DDR4 2133 MHz)
– Expansion slot: M.2. 2230 (E Key)
– Extended temperature

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PICO51R, sbc, single board computer, pico-itx, itx

PICO51R

– 7th Generation Intel® Core™ and Celeron® Processors (Kaby Lake)
– Up to 16GB RAM (1 x SODIMM for DDR4 2133 MHz)
– Expansion slot: M.2. 2230 (E Key)
– Extended temperature

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pico itx, sbc, single board computer

PICO318

– Intel® Atom™ and Celeron® N Processor (Apollo Lake)
– Up to 8GB RAM (1 x SODIMM for DDR3L 1867 MHz)
– 1 x Half-size PCI Express Mini Card slot with mSATA support
– Extended temperature

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PICO319, sbc, single board computer, pico-itx, itx

PICO319

– Intel® Atom® X processors (Apollo Lake)
– Up to 8GB RAM (1 x SODIMM for DDR3L 1867 MHz)
– 1 x Half-size PCI Express Mini Card slot with mSATA support
– Industrial temperature

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pico itx, sbc, single board computer

PICO512

– 7th Generation Intel® Core™ Processors (Kaby Lake)
– Up to 16GB RAM (1 x SODIMM for DDR4 2133 MHz)
– 1 x Full-size PCI Express Mini Card slot with mSATA support
– Extended temperature

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pico itx, sbc, single board computer

RICO-3288

– Rockchip RK3288 ARM Cortex™-A17 Quad-core processor
– 2GB RAM (Soldered DDR3L)
– Optional 7.4V Battery power input
– Standard temperature

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pico itx, sbc, single board computer

RICO-3399

– Rockchip RK3399 ARM Cortex™-A72 (Dual) or -A53 (Quad) processor
– 2GB RAM (Soldered LPDDR3)
– Optional 7.4V Battery power input
– Standard temperature

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Mini-ITX

AL170, sbc, single board computer, mini-itx, itx

AL170

– Intel® Atom™ and Celeron® Processor (Apollo Lake)
– Up to 8GB RAM (2 x SODIMM for DDR3L 1867 MHz)
– Tripple display support
– Standard or Industrial temperature

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mini itx, sbc, single board computer

CS100

– Socket LGA1151, for 8th generation Intel® Core™ processor (Coffee Lake), TDP up to 80W
– Up to 32GB RAM (2 x SODIMM for DDR4 2400/2666 MHz)
– Chipset: Intel® Q370, C246 or H310
– Standard temperature

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CS101-H310, sbc, single board computer, mini-itx, itx

CS101-H310

– Socket LGA1151, for 8th generation Intel® Xeon or Core™ processor (Coffee Lake), TDP up to 80W
– Up to 32GB RAM (2 x SODIMM for DDR4 2666 MHz)
– Expansion: M.2 2230 (E Key) and 1 x PCIe x4 (Generation 3)
– Standard temperature

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mini itx, sbc, single board computer

CS101 -Q370/C246

– Socket LGA1151, for 8th generation Intel® Xeon or Core™ processor (Coffee Lake), TDP up to 80W
– Up to 32GB RAM (2 x SODIMM for DDR4 2666 MHz, ECC support with C246)
– Tripple display support
– Standard temperature

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CS103-H310

CS103-H310

– 9th/8th Gen Intel® CoreTM Processor
– 2 DDR4 2666MHz SODIMM up to 32GB
– Multiple Expansions: 1 PCIe x4 Gen 3, 1 M.2 2230 E Key
– Standard temperature

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CS103-Q370-C246

CS103-Q370/C246

– 9th/8th Gen Intel® CoreTM Processor
– 2 DDR4 2666MHz SODIMM up to 32GB
– Multiple Expansions: 1 PCIe x4 Gen 3, 1 M.2 2280 M Key, 1 M.2 2230 E Key
– Standard temperature

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mini itx, sbc, single board computer

GH171

– AMD® Ryzen™ V1000/R1000 Series Processor
– Up to 32GB RAM (2 x SODIMM for DDR4 3200 MHz)
– Quadruple display support
– Standard temperature

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KD171, mini itx, sbc, single board computer

KD171

– Socket LGA1151, for 6/7th generation Intel® Core™ processor (Skylake or Kaby Lake), TDP up to 65W
– Up to 32GB RAM (2 x UDIMM for DDR4 2133/2400 MHz)
– Tripple display support
– Standard temperature

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KU171 KU173, mini itx, sbc, single board computer

KU171/KU173

– 7th Generation Intel® Core™ Processors (Kaby Lake)
– Up to 32GB RAM (2 x SODIMM for DDR4 1866/2133 MHz)
– DC-in, Ku171 (12V), KU173 (9-36V)
– Standard or Extended temperature

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mini itx, sbc, single board computer

MANO315

– Intel® Celeron® J Processor (Apollo Lake)
– Up to 8GB RAM (1 x SODIMM for DDR3L 1866 MHz)
– Expansion: PCIe Mini card and PCIe (1x)
– Standard temperature

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mini itx, sbc, single board computer

MANO520

– Socket LGA1151, for 8th generation Intel® Core™ processor (Coffee Lake)
– Up to 32GB RAM (2 x SODIMM for DDR4 2666 MHz)
– Chipset: Intel H310, optional Intel Q370
– Standard temperature

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Mano521, mini itx, sbc, single board computer

MANO521

– Socket LGA1151, for 8th generation Intel® Core™ processor (Coffee Lake)
– Up to 32GB RAM (2 x SODIMM for DDR4 2400/2666 MHz)
– Chipset: Intel H310, optional Intel Q370
– Standard temperature

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SD106-Q170, sbc, single board computer, mini-itx, itx

SD106-Q170

– Socket LGA1151, for 6th generation Intel® Core™ processor (Skylake)
– Up to 32GB RAM (2 x SODIMM for DDR4 1866/2133 MHz)
– Wide DC-in (15-36V)
– Standard temperature

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SD170, sbc, single board computer, mini-itx, itx

SD170

– Socket LGA1151, for 6/7th generation Intel® Core™ processor (Skylake or Kaby Lake), TDP up to 65W
– Up to 32GB RAM (2 x SODIMM for DDR4 2133 MHz)
– 4 x Intel® LAN I210AT or Intel® LAN I211AT support
– Standard temperature

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WL171-WL173

WL171/WL173

– 8th Gen Intel® CoreTM Processor
– DDR4 2400MHz SODIMM up to 64GB
– Three independent displays: LVDS*/V By One + DP++ + HDMI/DP++ (Auto-detecting)
– Standard temperature

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