COM Express Modules

The COM Express standard is a highly integrated and compact computer form factor. It specifies in four module sizes (Mini, Compact, Basic, Extended) and seven pinouts (1-6, 10) and was first introduces in 2005 by the PCI Industrial Computer Manufacturers Group (PICMG). Power consumption is up to 188 watts and COM Express modules are typically based on X86 processors. All I/O signals are mapped to two high density, low profile connectors on the bottom side of the module.

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Product listing

CH960-CM246/QM370

  • Intel® Xeon® and 8th Generation Intel® Core™ Processors (Coffee Lake)
  • Up to 32GB RAM (2 x SODIMM DDR4 2666 MHz, ECC support)
  • COM Express® Basic, Type 6
  • Standard or Industrial temperature

MTU9A2 – Intel Core Ultra Processor (Meteor Lake , U-series) – COM Express mini

  • Intel® Core™ Ultra Processor (Meteor Lake: U-series)
  • Single Channel LPDDR5 7467MHz up to 32GB
  • Dual Displays: 1 DDI + 1 eDP
  • Supports 4K / 2K resolution
  • Multiple Expansion: 4 PCIe x1, 1 I2C, 1 SMBus, 1 eSPI, 2 UART
  • Rich I/O: 1 Intel 2.5GbE, 2 USB 3.2, 8 USB 2.0, 2 SATA 3.0
  • 32 TOPS of Hybrid AI compute

CEM710 – COM Express® Basic module with Intel® Xeon® D-1700

  • Intel® Xeon® D-1700 series processor (Ice Lake D)
  • 2 DDR4-2400 SO-DIMM for up to 64 GB memory
  • 1 PCIe x16 Gen3 (PEG), 1 PCIe x8 Gen3, and 6 PCIe x1 Gen3
  • 2 SATA Gen3
  • 4 USB 3.0 and 4 USB 2.0
  • 4 10GBase-KR
  • Supports TPM 2.0

AL968

  • Intel® Atom®, Celeron® & Pentium® processors (Apollo Lake)
  • Up to 8GB RAM (2 x SODIMM DDR3L 1600 MHz)
  • COM Express® Compact, Type 6
  • Standard and Industrial temperature options

CH960-HM370

  • Intel® 8th Generation Intel® Core™ Processors (Coffee Lake)
  • Up to 32GB RAM (2 x SODIMM DDR4 2666 MHz)
  • COM Express® Basic, Type 6
  • Standard temperature or Industrial temperature with heat spreader

TGU9A2 – COM Express® Mini (Type 10) with 11th Gen Intel®

  • 11th Generation Intel® Processor COM Express® Mini
  • Single Channel LPDDR4X 4266MHz;Memory Down up to 16GB
  • Multiple expansions: 1 PCIe x4, 2 I2C, 1 SMBus
  • Rich I/O: 1 Intel GbE, 2 USB 3.2, 8 USB 2.0