{"id":3182,"date":"2026-02-06T21:29:15","date_gmt":"2026-02-06T21:29:15","guid":{"rendered":"https:\/\/hectronic.se\/?post_type=products&#038;p=3182"},"modified":"2026-04-09T00:20:50","modified_gmt":"2026-04-09T00:20:50","slug":"hectronic-h6075","status":"publish","type":"products","link":"https:\/\/hectronic.se\/sv\/products\/computer-on-module\/hectronic-h6075\/","title":{"rendered":"Hectronic H6075"},"content":{"rendered":"<h2 class=\"wp-block-heading\">Compact (70mm x 70mm) high-performance, low power COM module<\/h2>\n\n\n\n<figure class=\"wp-block-image size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"400\" height=\"375\" src=\"https:\/\/hectronic.se\/wp-content\/uploads\/2026\/02\/hectronic-h6075-2.png\" alt=\"Hectronic H6075\" class=\"wp-image-3184\" srcset=\"https:\/\/hectronic.se\/wp-content\/uploads\/2026\/02\/hectronic-h6075-2.png 400w, https:\/\/hectronic.se\/wp-content\/uploads\/2026\/02\/hectronic-h6075-2-300x281.png 300w\" sizes=\"(max-width: 400px) 100vw, 400px\" \/><\/figure>\n\n\n\n<figure class=\"wp-block-image size-full\"><img decoding=\"async\" width=\"400\" height=\"375\" src=\"https:\/\/hectronic.se\/wp-content\/uploads\/2026\/02\/hectronic-h6075.png\" alt=\"Hectronic H6075\" class=\"wp-image-3185\" srcset=\"https:\/\/hectronic.se\/wp-content\/uploads\/2026\/02\/hectronic-h6075.png 400w, https:\/\/hectronic.se\/wp-content\/uploads\/2026\/02\/hectronic-h6075-300x281.png 300w\" sizes=\"(max-width: 400px) 100vw, 400px\" \/><\/figure>\n\n\n\n<p>The H6075 is a compact (70mm x 70mm) high-performance, low power COM module based on the Intel\u00ae Atom\u2122 Apollo Lake System-on-Chip, SOC. The SOCs have the 9th generation Intel\u00ae HD Graphics Engine GPU built in along with a dual or quad core CPU and I\/O controller.<\/p>\n\n\n\n<p>The Qseven form factor makes H6075 a legacy free module with a full range of contemporary low voltage differential serial interfaces such as PCI Express, USB 3.0, SATA 3.0 and display interfaces such as DisplayPort or HDMI and Dual 24-bit LVDS.<\/p>\n\n\n\n<p>Qseven modules are defined for low cost and ruggedness, with an MXM type edgecard connector interfacing the carrier board. H6075 has soldered memory and optional on-board eMMC Flash.<\/p>\n\n\n\n<p>The H6075 is available in both standard and industrial grade operating temperature.<\/p>\n\n\n\n<div style=\"height:20px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<h4 class=\"wp-block-heading\">Specifikation<\/h4>\n\n\n\n<div style=\"height:20px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Dual or Quad Core Intel Atom<\/li>\n\n\n\n<li>Soldered DDR3L RAM memory<\/li>\n\n\n\n<li>9th Gen Intel HD Graphics<\/li>\n\n\n\n<li>Industrial temp. (optional)<\/li>\n<\/ul>\n\n\n\n<div style=\"height:10px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<div style=\"height:20px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<figure class=\"wp-block-image No-border\"><img decoding=\"async\" src=\"https:\/\/hectronic.se\/wp-content\/uploads\/2019\/03\/industrial.png\" alt=\"industrial\"\/><\/figure>\n\n\n\n<p><em><strong>Industrial temperature range<\/strong><br>-40\u00b0C to 85\u00b0C<\/em><\/p>\n\n\n\n<div style=\"height:20px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<figure class=\"wp-block-image No-border\"><img decoding=\"async\" src=\"https:\/\/hectronic.se\/wp-content\/uploads\/2019\/03\/f36350356772ee4a80179323c23d4cd6.png\" alt=\"f36350356772ee4a80179323c23d4cd6\"\/><\/figure>\n\n\n\n<div style=\"height:20px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<p><strong>Intel\u00ae Internet of Things Solutions Alliance<\/strong><br><em>Hectronic is an Affiliate member of the Intel\u00ae Internet of Things Solutions Alliance, a global ecosystem of 250+ member companies that provide scalable, interoperable solutions that accelerate deployment of intelligent devices and end-to-end analytics.<\/em><\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Compact (70mm x 70mm) high-performance, low power COM module The H6075 is a compact (70mm x 70mm) high-performance, low power COM module based on the Intel\u00ae Atom\u2122 Apollo Lake System-on-Chip, SOC. The SOCs have the 9th generation Intel\u00ae HD Graphics Engine GPU built in along with a dual or quad core CPU and I\/O controller. [&hellip;]<\/p>\n","protected":false},"featured_media":6326,"menu_order":0,"template":"","format":"standard","meta":{"footnotes":""},"products-category":[16,27],"class_list":["post-3182","products","type-products","status-publish","format-standard","has-post-thumbnail","hentry","products-category-computer-on-module","products-category-qseven-module"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Hectronic H6075 | Embedded Computer Systems - Nordic designer and manufacturer | Hectronic<\/title>\n<meta name=\"description\" content=\"H6075 \u2013 Qseven module from Hectronic. 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