Hectronic H6075

Compact (70mm x 70mm) high-performance, low power COM module

The H6075 is a compact (70mm x 70mm) high-performance, low power COM module based on the Intel® Atom™ Apollo Lake System-on-Chip, SOC. The SOCs have the 9th generation Intel® HD Graphics Engine GPU built in along with a dual or quad core CPU and I/O controller.

The Qseven form factor makes H6075 a legacy free module with a full range of contemporary low voltage differential serial interfaces such as PCI Express, USB 3.0, SATA 3.0 and display interfaces such as DisplayPort or HDMI and Dual 24-bit LVDS.

Qseven modules are defined for low cost and ruggedness, with an MXM type edgecard connector interfacing the carrier board. H6075 has soldered memory and optional on-board eMMC Flash.

The H6075 is available in both standard and industrial grade operating temperature.

Specification

Dual or Quad Core Intel Atom
Soldered DDR3L RAM memory
9th Gen Intel HD Graphics
Industrial temp. (optional)

Documentation

H6075

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Hectronic H6075

Compact (70mm x 70mm) high-performance, low power COM module

Specification

Documentation

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