embedded computer systems

Qseven Modules: Compact, Efficient, and Customizable Embedded Solutions

Qseven Module

The Qseven (Q7) standard is specifically designed for embedded mobile applications and integrates all core components of a common PC onto the extremely compact board. The Qseven board is mounted onto an application specific carrier board to offer customer-specific requirements. Dimensions are 70 mm x 70 mm with a maximum of 12 watt power consumption. Heat dissipation is kept at a minimum and fan-less operation possible. A robust and cost-efficient 230 pin MXM connector is used to connect the Qseven module with the carrier board. This MXM connector is a well-known high speed signal interface connector that is commonly used for high speed PCI Express graphics.

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Qseven Modules - Product listing

EHL700 (F220705)_w600

EHL700

– 4GB/8GB LPDDR4 Single Channel Memory Down
– 1 DDI*, 1 LVDS*/eDP
– DP++ resolution supports up to 4096×2160 @ 60Hz
– Multiple expansions: 4 PCIe x1
– Rich I/O: 1 Intel GbE, 2 USB 3.1, 8 USB 2.0
– 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)

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EHL701(B230725)_w600

EHL701

– 4GB/8GB/16GB LPDDR4 Dual Channel Memory Down
– Dual Displays: 1 DDI* + 1 eDP/LVDS
– DP++ resolution supports up to 4096×2160 @ 60Hz
– Multiple expansions: 4 PCIe x1
– Rich I/O: 1 Intel GbE, 2 USB 3.1, 8 USB 2.0

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RK701(B241001)_w600

RK701

– 2GB/4GB/8GB DDR4 Memory Down
– Supports 4K / 2K resolution
– 1 eDP/LVDS + 1 DP/TMDS
– Multiple expansions: 2 PCIe 3.0, 1 PCIe 2.0
– Rich I/O: 1 Realtek GbE, 1 USB 3.2, 4 USB 2.0

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qseven, h6089, hectronic

H6089

– Intel® Atom® processors (Elkhart Lake)
– Soldered LPDDR4x RAM memory
– 11th generation Intel® UHD Graphica Engine
– Q7 specification 2.1
– Industrial temperature

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hectronich6075, qseven

Hectronic H6075

– Intel® Atom® processors (Apollo Lake)
– Up to 8GB RAM (soldered DDR3L)
– 9th Generation of Intel HD Graphics
– Q7 specification 2.1
– Standard or Industrial temperature

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AL700, qseven

AL700

– Intel® Atom® processors (Apollo Lake)
– Up to 8GB RAM (soldered DDR3L 1600MHz)
– Q7 specification 2.1
– Standard or Industrial temperature

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AL701, qseven

AL701

– Intel® Atom® processors (Apollo Lake)
– Up to 8GB RAM (soldered LPDDR4 3200MHz)
– Q7 specification 2.1
– Standard or Industrial temperature

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Q7M310, qseven

Q7M310

– Intel® Atom® X processors (Apollo Lake)
– 4 or 8GB RAM (Soldered DDR3L)
– Q7 specification 2.0
– Extended or Industrial temperature

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Q7M311, qseven

Q7M311

– Intel® Celeron® & Pentium® N processors (Apollo Lake)
– 4 or 8GB RAM (Soldered DDR3L)
– Q7 specification 2.0
– Extended temperature

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Q7X-151

H4103 Carrier Board

– Expansion: 2 PCIe x1, 2 Mini PCIe, 1 SDIO
– Display outputs: 2 DP, 1 LVCS, 1 eDP
– USB: 3 USB 3.0, 8 USB 2.0
– Storage: 2 SATA 3.0

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