Bits & Pieces March 2015: Internet of Things - Building a case

This issue of B&P contains an article about Internet of things, a presentation of our experience from the transportation sector and the introduction of our brand new BSP for Android on TI Sitara.
Enjoy your reading!

Magnus Fritzson
Market Communications Manager

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Internet of Things - Building a case

An important question is what goal to address when investing in IoT, and how to gain the most customer benefit in doing so. We hope to get you inspired and to support you finding your own answer to the question.

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Transportation

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For more than two decades Hectronic has developed embedded computers for use in transportation. We offer COTS and custom development adapted to relevant requirements.
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Android BSP for TI Sitara

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All devices in the processor as well as a number of communication interfaces, display, touch screen and sensors are supported by the BSP for Android Jelly Bean 4.2.2.
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12.1 inch Touch Panel PC

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• Intel Atom BayTrail-M

• PCAP or resistive

• 500 cd/m2 brightness

• 4xUSB, 3xCOM, 2xLAN

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SBC with Intel Atom Bay Trail

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• Quad or dual core processor
• DDR3L memory up to 4GB
• 8xUSB, 4xCOM, 2xLAN
• +9 to +24 Volt DC input
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4th gen. Intel Core COM Exp.

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• Compact COM Express’

• Pinout typ 6

• Industrial temp. (optional)

• Soldered memory/storage

H6832 Product Page »

 

 

For feedback you are always welcome to contact me by e-mail: anna.edstrom@hectronic.se

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